2024-11-18
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November Packaging exhibition: swop2024 at the end of the inventory of those innovative intelligent manufacturing equipment, new materials with environmental protection functions and new regulations of the industry
The November Packaging exhibition, Shanghai World of Packaging (swop) will be held at the Shanghai New International Expo Center from November 18-20, 2024. This year, swop will present a new perspective for the packaging industry, and the exhibition content will focus on a number of new packaging hot topics.
Packaging "innovative processes and technologies" to make products more recognizable in the market
The November Packaging exhibition will become a display platform for the whole packaging industry chain, bringing together the cutting-edge "innovative processes and technologies" of various packaging links to help enterprises highlight market competition.
In terms of equipment, it will focus on the intelligent and automated technology of the front and back packaging, especially the intelligent system of transparent production schedule, so that enterprises can monitor the status of equipment in real time to ensure the output and opening rate, and the control technology of eliminating defective products will ensure product quality. In addition, the implementation of paperless operations will further improve work efficiency and reduce labor costs. At the same time, the cutting-edge technology of all-electric equipment not only saves energy and environmental protection, but also provides higher accuracy and stability. In addition, the new process of in-mold labeling and thin-wall injection molding will enhance product aesthetics and functionality, making your packaging design more competitive.
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